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the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. bipolar analog integrated circuits m m m m pc2747tb, m m m m pc2748tb 3 v, super minimold silicon mmic amplifier for mobile commumications document no. p13444ej2v0ds00 (2nd edition) date published june 1999 n cp(k) printed in japan data sheet 1998, 1999 the mark shows major revised points. description the m pc2747tb, m pc2748tb are silicon monolithic integrated circuits designed as amplifier for mobile communications. these ics are packaged in super minimold package which is smaller than conventional minimold. the m pc2747tb, m pc2748tb have compatible pin connections and performance to m pc2747t, m pc2748t of conventional minimold version. so, in the case of reducing your system size, m pc2747tb, m pc2748tb are suitable to replace from m pc2747t, m pc2748t. these ics are manufactured using necs 20 ghz f t nesat tm lll silicon bipolar process. this process uses silicon nitride passivation film and gold electrodes. these materials can protect chip surface from external pollution and prevent corrosion/migration. thus, these ics have excellent performance, uniformity and reliability. features ? high-density surface mounting : 6-pin super minimold package ? supply voltage : v cc = 2.7 to 3.3 v ? noise figure : m pc2747tb ; nf = 3.3 db typ. @ f = 900 mhz : m pc2748tb ; nf = 2.8 db typ. @ f = 900 mhz ? upper limit operating frequency : m pc2747tb ; f u = 1.8 ghz typ. : m pc2748tb ; f u = 1.5 ghz typ. application ? buffer amplifiers for mobile telephones, etc. (pdc800m, gsm) ordering information part number package marking supplying form m pc2747tb-e3 c1s m pc2748tb-e3 6-pin super minimold c1t embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. qty 3 kp/reel. remark to order evaluation samples, please contact your local nec sales office. (part number for sample order: m pc2747tb, m pc2748tb) caution electro-static sensitive devices
data sheet p13444ej2v0ds00 2 m m m m pc2747tb, m m m m pc2748tb pin connections pin no. pin name 1 input 2gnd 3gnd 4output 5gnd c1s 3 2 1 4 5 6 (top view) (bottom view) 4 5 6 3 2 1 6v cc marking is an example of m pc2747tb product line-up (t a = +25c, v cc = 3.0 v, z l = z s = 50 w w w w ) part no. f u (ghz) p o(sat) (dbm) g p (db) nf (db) i cc (ma) package marking m pc2747t 6-pin minimold m pc2747tb 1.8 C7.0 12 3.3 5.0 6-pin super minimold c1s m pc2748t 6-pin minimold m pc2748tb 0.2 to 1.5 C3.5 19 2.8 6.0 6-pin super minimold c1t remark typical performance. please refer to electrical characteristics in detail. notice the package size distinguishes between minimold and super minimold. system application example example of 900 mhz band digital celluler telephone digtal cellular system block diagram sw pa psc+pll pll i q demo i q 0? 90? f tx rx : pc2747tb, pc2748tb applicable m m
data sheet p13444ej2v0ds00 3 m m m m pc2747tb, m m m m pc2748tb pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications internal equivalent circuit 0.80 1 input ? 0.80 signal input pin. a internal matching circuit, configured with resistors, enables 50 w connection over a wide band. this pin must be coupled to signal source with capacitor for dc cut. 2.79 4output ? 2.72 signal output pin. a internal matching circuit, configured with resistors, enables 50 w connection over a wide band. this pin must be coupled to next stage with capacitor for dc cut. 6v cc 2.7 to 3.3 ? power supply pin. this pin should be externally equipped with bypass capacity to minimize ground impedance. 2 3 5 gnd 0 ? ground pin. this pin should be connected to system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. all the ground pins must be connected together with wide ground pattern to decrease impedance difference. v cc out gnd gnd in * 1 6 4 5 2 3 the above diagram is for the m pc2747tb. the resistor marked with an asterisk does not exist in the m pc2748tb. note pin voltage is measured at v cc = 3.0 v. above: m pc2747tb, below: m pc2748tb
data sheet p13444ej2v0ds00 4 m m m m pc2747tb, m m m m pc2748tb absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25c 4.0 v circuit current i cc t a = +25c 15 ma power dissipation p d mounted on double sided copper clad 50 50 1.6 mm epoxy glass pwb (t a = +85c) 200 mw operating ambient temperature t a - 40 to +85 c storage temperature t stg - 55 to +150 c input power level p in t a = +25c 0 dbm recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 2.7 3.0 3.3 v operating ambient temperature t a - 40 +25 +85 c electrical characteristics (t a = +25 c, v cc = 3.0 v, z s = z l = 50 w w w w ) m pc2747tb m pc2748tb parameter symbol test conditions min. typ. max. min. typ. max. unit circuit current i cc no signal 3.8 5.0 7.0 4.5 6.0 8.0 ma power gain g p f = 900 mhz 9 12 14 16 19 21 db maximum output level p o(sat) f = 900 mhz p in = C8 dbm C9.5 C7.0 C C6.0 C3.5 C dbm noise figure nf f = 900 mhz C 3.3 4.5 C 2.8 4.0 db upper limit operating frequency f u 3 db down below from gain at f = 900 mhz 1.51.8C1.21.5Cghz lower limit operating frequency f l 3 db down below from gain at f = 900 mhz CCCC0.20.4ghz isolation isl f = 900 mhz 35 40 C 35 40 C db input return loss rl in f = 900 mhz 11 14 C 8.5 11.5 C db output return loss rl out f = 900 mhz 7 10 C 5.5 8.5 C db
data sheet p13444ej2v0ds00 5 m m m m pc2747tb, m m m m pc2748tb standard characteristics for reference (t a = +25 c, z l = z s = 50 w w w w ) reference parameter symbol test conditions m pc2747tb m pc2748b unit circuit current i cc v cc = 1.8 v, no signals 3.0 3.5 ma power gain g p v cc = 1.8 v, f = 900 mhz 5.5 11.5 db maximum output level p o(sat) v cc = 1.8 v, f = 900mhz, pin = - 8 dbm - 13.7 - 10.0 dbm noise figure nf v cc = 1.8 v, f = 900 mhz 5.2 4.5 db upper limit operating frequency f u v cc = 1.8 v, 3 db down below from gain at f = 900 mhz 1.8 1.5 ghz lower limit operating frequency f l v cc = 1.8 v, 3 db down below from gain at f = 900 mhz ? 0.2 ghz isolation isl v cc = 1.8 v, f = 900mhz 34 34 db input return loss rl in v cc = 1.8 v, f = 900mhz 11 10 db output return loss rl out v cc = 1.8 v, f = 900mhz 13 12 db v cc = 3.0 v, p out = - 20 dbm, f 1 = 900 mhz, f 2 = 902 mhz - 34 - 38 3rd order intermodulation distortion im 3 v cc = 1.8 v, p out = - 20 dbm, f 1 = 900 mhz, f 2 = 902 mhz - 20 - 28 dbc
data sheet p13444ej2v0ds00 6 m m m m pc2747tb, m m m m pc2748tb test circuit 50 w in c 1 1 6 4 2, 3, 5 c 3 1 000 pf c 2 1 000 pf 50 w out v cc 1 000 pf example of application circuit 50 w in c 1 1 6 4 2, 3, 5 c 3 1 000 pf v cc c 4 1 000 pf c 5 1 6 4 2, 3, 5 c 6 1 000 pf c 2 1 000 pf 50 w out 1 000 pf 1 000 pf r 1 50 to 200 w to stabilize operation, please connect r 1 , c 5 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. capacitors for v cc , input and output pins 1 000 pf capacitors are recommendable as bypass capacitor for v cc pin and coupling capacitors for input/output pins. bypass capacitor for v cc pin is intended to minimize v cc pins ground impedance. therefore, stable bias can be supplied against v cc fluctuation. coupling capacitors for input/output pins are intended to minimize rf serial impedance and cut dc. to get flat gain from 100 mhz up, 1 000 pf capacitors are assembled on the test circuit. [actually, 1 000 pf capacitors give flat gain at least 10 mhz. in the case of under 10 mhz operation, increase the value of coupling capacitor such as 2 200 pf. because the coupling capacitors are determined by the equation of c = 1/(2 p fzs).]
data sheet p13444ej2v0ds00 7 m m m m pc2747tb, m m m m pc2748tb illustration of the test circuit assembled on evaluation board mounting direction (marking is an example for pc2747tb) notes 1. 2. 3. 4. 30 30 0.4 mm double sided copper clad polyimide board. back side: gnd pattern solder plated on pattern : through holes top view in out c v cc amp-2 cc m c1s 3 2 1 4 5 6 for more information on the use of this ic, refer to the following application note: usage and applications of 6-pin mini-mold, 6-pin super mini-mold silicon high-frequency wideband amplifier mmic (p11976e). component list value c 1 000 pf
data sheet p13444ej2v0ds00 8 m m m m pc2747tb, m m m m pc2748tb typical characteristics (unless otherwise specified, t a = +25 c) - m pc2747tb - v cc = 3.0 v insertion power gain vs. frequency insertion power gain g p (db) frequency f (ghz) noise figure vs. frequency 0.1 0.3 1.0 3.0 2 3 4 5 6 7 noise figure nf (db) frequency f (ghz) 0 20 15 10 5 0.1 0.3 1.0 3.0 insertion power gain vs. frequency insertion power gain g p (db) frequency f (ghz) 0 20 15 10 5 0.1 0.3 1.0 3.0 v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v v cc = 1.8 v v cc = 3.0 v v cc = 3.3 v v cc = 1.8 v circuit current vs. supply voltage circuit current vs. operating ambient temperature circuit current i cc (ma) circuit current i cc (ma) supply voltage v cc (v) operating ambient temperature t a ( c) 10 8 6 4 2 0 10 8 6 4 2 0 01234 ?0 ?0 ?0 0 +20 +40 +60 +80 +100 v cc = 3.0 v v cc = 1.8 v t a = +85 c t a = ?0 c t a = +25 c no signal no signal v cc = 2.7 v
data sheet p13444ej2v0ds00 9 m m m m pc2747tb, m m m m pc2748tb - m pc2747tb - p in = ? dbm f = 900 mhz v cc = 3.0 v f = 900 mhz 0.1 0.3 1.0 3.0 0 ?0 ?0 ?0 ?0 ?0 0 ?0 ?0 ?0 ?0 ?0 0.1 0.3 1.0 3.0 0 ? ?0 ?5 ?0 ?5 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 ?0 0 ?5 ?5 ?5 ?5 ? 30 28 26 24 22 20 18 16 14 12 10 third order intermodulation distorition im 3 (dbc) output power of each tone p o (each) (dbm) isolation vs. frequency input return loss, output return loss vs. frequency output power vs. input power output power vs. input power isolation isl (db) output power p out (dbm) input return loss rl in (db) output return loss rl out (db) output power p out (dbm) frequency f (ghz) frequency f (ghz) input power p in (dbm) saturated output power vs. frequency saturared output power p o (sat) (dbm) frequency f (ghz) third order intermodulation distortion vs. output power of each tone input power p in (dbm) 0 ? ?0 ?5 ?0 ?5 ?0 0 ? ?0 ?5 ?0 ?5 ?0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 v cc = 3.3 v v cc = 3.0 v v cc = 1.8 v v cc = 3.0 v rl in (v cc = 1.8 v) rl out (v cc = 3.0 v) rl in (v cc = 3.0 v) rl out (v cc = 1.8 v) v cc = 2.7 v v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v v cc = 1.8 v v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v t a = +85 c t a = +85 c t a = ?0 c t a = ?0 c t a = +25 c t a = +25 c f 1 = 900 mhz f 2 = 902 mhz
data sheet p13444ej2v0ds00 10 m m m m pc2747tb, m m m m pc2748tb s-parameter (t a = +25 c, v cc = 3.0 v) - m pc2747tb - s 11 -frequency 0.1 g 1.0 g 2.0 g 3.0 g s 22 -frequency 0.1 g 1.0 g 2.0 g 3.0 g
data sheet p13444ej2v0ds00 11 m m m m pc2747tb, m m m m pc2748tb typical s-parameter values (t a = +25 c) m pc2747tb v cc = 3.0 v, i cc = 5.0 ma frequency s 11 s 21 s 12 s 22 k mhz mag. ang. mag. ang. mag. ang. mag. ang. 100.0000 0.091 - 178.3 3.732 - 3.9 0.001 28.0 0.290 - 3.7 98.96 200.0000 0.105 - 161.2 3.997 - 13.3 0.002 103.2 0.294 - 4.3 64.71 300.0000 0.136 - 166.8 4.075 - 23.4 0.002 76.0 0.292 - 3.9 46.80 400.0000 0.165 - 172.9 4.105 - 32.9 0.004 90.4 0.286 - 5.6 29.99 500.0000 0.179 177.8 4.141 - 41.2 0.004 89.4 0.298 - 6.9 25.94 600.0000 0.185 170.1 4.098 - 49.5 0.005 90.7 0.302 - 8.4 20.69 700.0000 0.189 162.5 4.124 - 57.9 0.006 96.6 0.307 - 10.2 17.38 800.0000 0.189 155.1 4.104 - 66.3 0.008 101.3 0.309 - 12.2 12.59 900.0000 0.182 148.8 4.061 - 74.5 0.009 99.2 0.313 - 14.4 12.26 1000.0000 0.180 142.6 4.016 - 83.0 0.012 99.9 0.316 - 16.9 9.45 1100.0000 0.174 137.1 3.977 - 91.8 0.013 100.3 0.318 - 19.7 8.22 1200.0000 0.160 131.5 3.948 - 99.5 0.015 105.5 0.318 - 22.6 7.49 1300.0000 0.148 127.4 3.799 - 108.4 0.016 96.6 0.318 - 24.9 7.42 1400.0000 0.134 124.4 3.736 - 115.9 0.019 93.8 0.313 - 27.4 6.36 1500.0000 0.124 121.0 3.582 - 124.0 0.022 93.8 0.311 - 30.1 5.83 1600.0000 0.110 121.0 3.506 - 131.7 0.023 88.1 0.312 - 31.8 5.55 1700.0000 0.099 122.9 3.317 - 138.8 0.025 88.6 0.308 - 33.3 5.37 1800.0000 0.089 126.8 3.190 - 145.7 0.028 88.3 0.305 - 35.1 5.05 1900.0000 0.084 134.8 3.040 - 152.8 0.030 80.2 0.305 - 37.2 4.98 2000.0000 0.085 141.7 2.901 - 159.0 0.032 78.7 0.303 - 38.8 4.97 2100.0000 0.087 148.1 2.736 - 164.8 0.034 77.6 0.299 - 40.9 4.99 2200.0000 0.092 152.1 2.645 - 170.8 0.035 73.0 0.304 - 41.5 4.97 2300.0000 0.102 156.6 2.507 - 176.3 0.037 72.5 0.304 - 42.2 4.93 2400.0000 0.114 158.7 2.395 177.8 0.038 68.5 0.305 - 44.7 5.01 2500.0000 0.126 161.4 2.312 172.9 0.041 66.2 0.317 - 45.8 4.76 2600.0000 0.136 160.6 2.218 168.1 0.042 64.0 0.319 - 47.8 4.78 2700.0000 0.154 161.3 2.136 162.1 0.042 60.4 0.323 - 50.8 4.88 2800.0000 0.168 160.4 2.036 157.8 0.044 54.8 0.331 - 54.1 4.88 2900.0000 0.180 157.9 1.952 151.6 0.044 53.0 0.330 - 57.5 5.07 3000.0000 0.196 155.2 1.847 147.6 0.043 47.2 0.332 - 60.9 5.45 3100.0000 0.208 152.5 1.757 141.6 0.045 44.0 0.331 - 65.5 5.49
data sheet p13444ej2v0ds00 12 m m m m pc2747tb, m m m m pc2748tb typical characteristics (unless otherwise specified, t a = +25 c) - m pc2748tb - v cc = 3.0 v insertion power gain vs. frequency insertion power gain g p (db) frequency f (ghz) noise figure vs. frequency 0.1 0.3 1.0 3.0 2 3 4 5 6 7 noise figure nf (db) frequency f (ghz) 0 20 25 15 10 5 0 20 25 15 10 5 0.1 0.3 1.0 3.0 insertion power gain vs. frequency insertion power gain g p (db) frequency f (ghz) 0.1 0.3 1.0 3.0 v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v v cc = 1.8 v v cc = 3.0 v v cc = 3.3 v v cc = 2.7 v v cc = 1.8 v circuit current vs. supply voltage circuit current vs. operating ambient temperature circuit current i cc (ma) circuit current i cc (ma) supply voltage v cc (v) operating ambient temperature t a ( c) 10 8 6 4 2 0 10 8 6 4 2 0 012345 ?0 ?0 ?0 0 +20 +40 +60 +80 +100 v cc = 3.0 v v cc = 1.8 v t a = +85 c t a = ?0 c t a = +25 c no signal no signal
data sheet p13444ej2v0ds00 13 m m m m pc2747tb, m m m m pc2748tb - m pc2748tb - p in = ? dbm v cc = 3.0 v f = 900 mhz f = 900 mhz 0.1 0.3 1.0 3.0 0 ?0 ?0 ?0 ?0 ?0 0 ?0 ?0 ?0 ?0 ?0 0.1 0.3 1.0 3.0 +5 0 ? ?0 ?5 ?0 0.1 0.3 1.0 3.0 ?0 ?0 ?0 ?0 ?0 ?5 ?5 ?5 ?5 ? 0 30 28 26 24 22 20 18 16 14 12 10 third order intermodulation distortion im 3 (dbc) output power of each tone p o (each) (dbm) isolation vs. frequency input return loss, output return loss vs. frequency output power vs. input power output power vs. input power isolation isl (db) output power p out (dbm) input return loss rl in (db) output return loss rl out (db) output power p out (dbm) frequency f (ghz) frequency f (ghz) input power p in (dbm) saturated output power vs. frequency saturated output power p o (sat) (dbm) frequency f (ghz) third order intermodulation distortion vs. output power of each tone input power p in (dbm) 0 ? ?0 ?5 ?0 ?5 ?0 0 ? ?0 ?5 ?0 ?5 ?0 ?0 ?5 ?0 ?5 ?0 ?5 ?10 ? 0 ?0 ?5 ?0 ?5 ?0 ?5 ?0 ? 0 v cc = 3.3 v v cc = 3.0 v v cc = 1.8 v v cc = 3.0 v v cc = 2.7 v v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v v cc = 1.8 v v cc = 3.3 v v cc = 3.0 v v cc = 2.7 v t a = +85 c t a = +85 c t a = ?0 c t a = ?0 c t a = +25 c t a = +25 c f 1 = 900 mhz f 2 = 902 mhz rl in (v cc = 1.8 v) rl out (v cc = 3.0 v) rl in (v cc = 3.0 v) rl out (v cc = 1.8 v)
data sheet p13444ej2v0ds00 14 m m m m pc2747tb, m m m m pc2748tb s-parameter (t a = +25 c, v cc = 3.0 v) - m pc2748tb - s 11 -frequency 0.1 g 1.0 g 2.0 g s 22 -frequency 0.1 g 1.0 g 3.0 g
data sheet p13444ej2v0ds00 15 m m m m pc2747tb, m m m m pc2748tb typical s-parameter values (t a = +25 c) m pc2748tb v cc = 3.0 v, i cc = 6.0 ma frequency s 11 s 21 s 12 s 22 k mhz mag. ang. mag. ang. mag. ang. mag. ang. 100.0000 0.120 - 177.2 4.730 5.3 0.000 - 30.4 0.280 - 2.2 352.73 200.0000 0.136 - 167.3 5.430 - 0.2 0.001 19.3 0.285 - 2.4 72.83 300.0000 0.166 - 174.2 5.930 - 9.2 0.001 97.8 0.286 - 0.9 52.47 400.0000 0.194 179.6 6.314 - 18.8 0.003 125.4 0.291 - 2.7 24.77 500.0000 0.210 169.6 6.701 - 28.2 0.004 108.7 0.306 - 3.7 16.82 600.0000 0.213 160.0 6.876 - 38.8 0.005 107.4 0.319 - 5.4 12.40 700.0000 0.213 150.2 7.203 - 49.3 0.006 98.7 0.337 - 8.4 10.09 800.0000 0.211 140.8 7.310 - 60.6 0.009 114.1 0.349 - 12.3 6.68 900.0000 0.203 131.1 7.354 - 71.5 0.010 107.6 0.360 - 17.4 5.68 1000.0000 0.193 121.1 7.371 - 81.9 0.012 98.3 0.371 - 22.7 4.71 1100.0000 0.180 110.8 7.346 - 92.8 0.014 99.1 0.366 - 28.9 3.98 1200.0000 0.159 100.6 7.334 - 102.4 0.015 97.5 0.359 - 35.3 4.01 1300.0000 0.136 90.6 7.001 - 112.6 0.016 91.4 0.342 - 40.7 3.95 1400.0000 0.115 79.2 6.834 - 121.3 0.018 84.1 0.320 - 46.0 3.71 1500.0000 0.096 70.4 6.437 - 130.1 0.019 84.8 0.296 - 50.5 3.77 1600.0000 0.072 60.9 6.181 - 138.2 0.020 82.4 0.271 - 53.0 3.81 1700.0000 0.049 47.5 5.710 - 145.4 0.020 78.9 0.247 - 55.1 4.13 1800.0000 0.024 36.5 5.372 - 152.5 0.021 73.5 0.228 - 55.7 4.22 1900.0000 0.007 - 6.0 5.014 - 158.6 0.021 74.1 0.208 - 55.7 4.57 2000.0000 0.014 - 126.0 4.724 - 164.1 0.024 74.9 0.198 - 52.8 4.37 2100.0000 0.034 - 141.3 4.405 - 169.7 0.024 71.5 0.188 - 52.1 4.70 2200.0000 0.047 - 147.7 4.175 - 174.7 0.026 73.6 0.190 - 47.8 4.44 2300.0000 0.063 - 156.9 3.933 - 179.5 0.026 71.2 0.185 - 45.3 4.81 2400.0000 0.079 - 161.1 3.738 175.3 0.028 69.1 0.192 - 44.7 4.58 2500.0000 0.094 - 165.5 3.579 171.2 0.030 63.8 0.202 - 43.2 4.48 2600.0000 0.108 - 169.0 3.411 166.5 0.030 64.7 0.214 - 43.6 4.59 2700.0000 0.123 - 174.7 3.283 161.4 0.032 64.6 0.222 - 45.7 4.54 2800.0000 0.139 - 178.9 3.107 157.3 0.031 58.9 0.238 - 47.6 4.83 2900.0000 0.151 175.9 2.989 151.4 0.032 53.2 0.240 - 52.4 4.84 3000.0000 0.164 170.5 2.814 147.3 0.033 51.6 0.251 - 55.8 4.99 3100.0000 0.178 166.0 2.680 141.5 0.034 47.3 0.254 - 61.4 5.07
data sheet p13444ej2v0ds00 16 m m m m pc2747tb, m m m m pc2748tb pacage dimensions 6 pin super minimold (unit: mm) 1.25 0.1 2.1 0.1 0.65 0.65 1.3 2.0 0.2 0.1 min. 0.7 0.9 0.1 0 to 0.1 0.2 +0.1 ? 0.15 +0.1 ?
data sheet p13444ej2v0ds00 17 m m m m pc2747tb, m m m m pc2748tb notes on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). all the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) the bypass capacitor should be attached to v cc line. (4) the dc cut capacitor must be attached to input pin. recommended soldering conditions this product should be soldered under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nec sales representative. soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235 c or below time: 30 seconds or less (at 210 c) count: 3, exposure limit: none note ir35-00-3 vps package peak temperature: 215 c or below time: 40 seconds or less (at 200 c) count: 3, exposure limit: none note vp15-00-3 wave soldering soldering bath temperature: 260 c or below time: 10 seconds or less count: 1, exposure limit: none note ws60-00-1 partial heating pin temperature: 300 c time: 3 seconds or less (per side of device) exposure limit: none note C note after opening the dry pack, keep it in a place below 25 c and 65 % rh for the allowable storage period. caution do not use different soldering methods together (except for partial heating). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e).
data sheet p13444ej2v0ds00 18 m m m m pc2747tb, m m m m pc2748tb [memo]
data sheet p13444ej2v0ds00 19 m m m m pc2747tb, m m m m pc2748tb [memo]
m m m m pc2747tb, m m m m pc2748tb nesat (nec silicon advanced technology) is a trademark of nec corporation. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. ? nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. ? descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. ? while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. ? nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98. 8

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